SPECIFICATION // SPEC-05

Ultra-Low-Cost FDM Phone Stand & FEA

SolidWorks Parametric CAD • Linear Static FEA • FDM 3D Printing • Lean Value Engineering

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Complete SolidWorks A-Frame Phone Stand CAD Model
PARAMETRIC CAD // A-FRAME PASS-THROUGH GEOMETRY
SOLIDWORKS // FDM PLA DIGITAL PROTOTYPE
[0.04 lb / 18 g] [Sub-$1.00 Unit Cost] [iPhone 14 Pro Compatible] [FOS > 45]

Project Overview

This project centered around the CAD modeling, finite element structural analysis, and additive manufacturing of an ultra-low-cost desktop phone stand tailored for an iPhone 14 Pro (with a protective case). The core objective was to achieve robust multi-orientation stability in both portrait and landscape viewing positions while incorporating an open pass-through channel for continuous charging cable routing—all while adhering to a strict sub-$1.00 total production cost threshold.

Starting in SolidWorks, I modeled an ergonomic A-frame architecture featuring dual cantilevered support flanges and a central power cable clearance slot. To ensure structural durability prior to physical production, linear static Finite Element Analysis (FEA) was performed in SolidWorks Simulation by applying distributed downward operational loads across the support ledges under fixed base boundary conditions. Through 3 iterative design cycles, stress concentrations and low moment-of-inertia risks at the flange transitions were systematically eliminated by introducing generous stress-relief fillets and optimizing viewing pitch angles.

The final design was fabricated via FDM 3D printing in PLA, yielding an ultra-lightweight 0.04 lb (18 g) stand capable of sustaining over 6× its own mass without plastic deformation. FEA simulations confirmed a peak von Mises stress of only 0.88 MPa (yielding a Factor of Safety > 45) and a negligible maximum deflection of 0.070 mm (70 µm), demonstrating a highly repeatable balance of lean value engineering, rapid prototyping, and structural optimization.

Key Contributions

  • Engineered an ultra-lightweight 0.04 lb (18 g) A-frame PLA phone stand in SolidWorks featuring dual support flanges and a central pass-through cable routing channel.
  • Executed linear static FEA simulations in SolidWorks Simulation, achieving a peak von Mises stress of 0.88 MPa (Factor of Safety > 45) and a negligible 0.070 mm (70 µm) max deflection.
  • Iterated through 3 rapid prototyping cycles with FDM 3D printing to validate dual-orientation (portrait and landscape) stability for an iPhone 14 Pro while maintaining production costs strictly below $1.00.
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